The Effect of Thermal Interface Material on Led Heat Sinks

Authors

  • Deepak R Chandran Iris Energy LLC, United States.
  • Haricharan Kannan Iris Energy LLC, United States.

Keywords:

Junction Temperature, Thermocouple, Surface Temperature, LED, Aluminum, Thermal Conductivity, Junction Temperature and Natural Convection

Abstract

LED’S have been used in many products due to its longevity, more power saving and higher lumens per watt. About 80% of the electrical power is wasted as heat or reductant heat which in turn increases the junction temperature of the LED’s. This increase in the temperature in the LED’S decreases the longevity and color of LED’S. Proper thermal management is required to remove this heat effectively. The heat sink design and usage of proper thermal interface materials for increasing the heat removal is required. In this paper, temperature increase in a LED fixture during a time interval with and without thermal interface material is measured and tabulated to find the effectiveness of the thermal interface material in removing more heat is studied. In addition, a simulation using Solidworks thermal simulation is done to validate the analytical thermal-time study results. The entire study we provide a guideline for the design of LED high bays in future and demonstrate the importance of the thermal interface materials in the design studied

References

[1] AnnaAndonova,RumenYordanov,IrenaYordanova,“Thermal Stability Analysis of Power LED During Aging”, 978-1–4577–2112–0/2011/$ 26.00 © 2011 IEEE.
[2] Shanmugan, M. Norazlina, and D. Mutharasu, “Thermal transient analysis of LED using carbon doped AlN film deposited on metal substrate as heat sink,” Opt. Quantum Electron., vol. 47, no. 5,pp. 1245–1253, 2015, doi: 10.1007/s11082-014-9985-0.
[3] Devo n Je n k in s , A n s h uma n B h a r g a v a,“Maximizing the reliability, safety, and efficiency of light fixtures in hazardous environments”, 0.1109/MIAS.2014.2345829, 31 October 2014.
[4] S. Di Pascolia, P. E. Bagnolia, and C. Casarosab, “Thermal analysis of insulated metal substrates for automotive electronic assemblies,”Microelectron. J., vol. 30, no. 11, pp. 1129–1135, 1999.
[5] Devon Jenkins, Anshuman Bhargava,“SELECTING THE PROPER LED LIGHT FIXTURE TO ENHANCE SAFETY IN HARSH & HAZARDOUS ENVIRONMENTS”,978-1-4799-2288-8/14/$31.00 © 2014 IEEE.

Published

2019-01-04