Study of Parameters of Liquid Cooling for Microscale Heat Transfer: A Review
Keywords:
Micochannels, Nanofluids, Thermal conductivity, Convective heat flow, Thermal resistance.Abstract
In an electronic component, high processing power in compact chips results in large heat dissipation. The aim of this article is to study and analyze the parameters of liquids for microscale heat transfer as it is an evolving trend from research point of view. Further, the range of coolants used for microscale heat transfer can vary from water, ethylene glycol, and liquid metal to nanofluids. Heat transfer in microchannel using nanofluid as coolant is highly efficient as it has higher heat dissipation capacity than water used as coolant. Microchannel cooling with liquid metal poses tough challenge with regard to corrosion and blocking problems in the cooling system. The heat transfer characteristics of the nanofluids for microchannel applications would be studied and the parameters like thermal conductivity of different nanofluids compared in the present article.
References
[2] Peng XF, Peterson GP, Wang BX. Flow boiling of binary mixtures in microchannel plates. International Journal of Heat and Mass Transfer 1996; 39: 1257-64.
[3] Momoda LA, Phelps AC. US20026447692B1 (2002) and WO0212413A2 (2002).
[4] Yin JM, Bullard CW, Hrnjak PS. Single phase pressure drop measurement in a microchannel heat exchanger. Heat Transfer Engineering 2002; 23: 3-12.
[5] Qing-Zhong X. Model for effective thermal conductivity of nanofluids. Department of Applied Physics, University of Petroleum, Shandong Dongying 257062, Dec 2002.
[6] Withers JC, Loutfy RO. US20046695974B2 (2004).
[7] Si K. Methods for thermal optimization of microchannel heat sinks. Heat Transfer Engineering 2004; 25: 37-48. [8] Min JY, Kini SJ. Effect of tip clearance on the cooling performance of a microchannel heat sink. International Journal of Heat and Mass Transfer 2004; 47: 1099-103.
[9] Murshed SMS, Leong KC, Yang C. Enhanced thermal conductivity of TiO2- water based nanofluids. School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore, Dec 2004.
[10] Xu JL, Gan YH, Zhang DC et al. Micro scale heat transfer enhancement using thermal boundary layer developing concept. International Journal of Heat and Mass Transfer 2005; 48: 1662-74.
[11] Lee PS, Garimella SV. Thermally developing flow and heat transfer in rectangular microchannels of different aspect ratios. International Journal of Heat and Mass Transfer 2006; 49: 3060- 67.
[12] Kandlikar SG, Upadhye HR. Extending the heat flux limit with enhanced microchannels in direct single-phase cooling of computer chips. IEEE Semi- Therm 21, San Jose, Mar 15–17, 2005: 8- 15.
[13] Dixit P, Lin N, Miaoa J et al. Silicon nanopillars based 3D stacked microchannel heat sinks concept for enhanced heat dissipation applications in MEMS packaging. Sens Actuator 2008; 141: 685-94.
[14] Cheng L. School of Engineering, University of Aberdeem, King’s college, Aberdeem, AB24 3FX, Scotland, UK. 2008.
[15] Das SK. Heat Transfer and Thermal Power Lab, Mechanical Engineering Department, Indian Institute of Technology, Madras, India 600036.
[16] Rahimi M, Mehryar R. Numerical study of axial heat conduction effects on the local Nusselt number at the entrance and ending regions of a circular microchannel. International Journal of Thermal Sciences 2012; 59: 87-94.
[17] Xie GN, Liu YQ, Zhang WL et al. Computational study and optimization of laminar heat transfer and pressure loss of double-layer microchannels for chip liquid cooling. Journal of Thermal Science and Engineering Applications 2013; 5.
[18] Garg H, Negi VS, Garg N et al. Numerical and experimental analysis of microchannel heat transfer for nanoliquid coolant using different shapes and geometries. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science Sep 2014.